K-9741 Epoxy resin
Usage
- Used for electronic parts such as circuit boards or electronic devices.
- Resistant to changes in temperature and humidity, suitable for coating printed circuit boards (PCBs), non-corrosive, and pollutant-free.
Specific Characteristics
- Non-rigid | Exterior Appearance: A = Black, B = Brown
- Density (g/cm^3): A = 1.45
1.80, B = 1.081.15 - Viscosity (mpa.s): A = 30000
40000, B = 100250 - Mixing Ratio (by weight): A:B = 5:1
- Initial Setting Time (25℃, min): 90
- Full Curing Time (25℃, hour): 24-25
Rigidity | Physical Properties
- Hardness (Shore A): ≥ 80
- Tensile Strength (mpa): ≥ 10
- Temperature Stability (℃): -30~100
- Shrinkage (%): ≤ 0.5
Electrical Properties
- Dielectric Strength (kV/mm): ≥ 15
- Dielectric Constant (100KHz): 3.0±0.1
- Dielectric Loss (100KHz): ≤ 0.01
- Volume Resistivity (Ω.cm): ≥ 1.0×10^15
Instructions
- Clean the container for the adhesive and the circuit board material.
- Before use, weigh substance A before mixing with substance B to ensure accuracy according to the mixing ratio.
- Adjust the mixing ratio as needed for the current application.
- Promptly close the container of substance B after weighing and pouring into the container with substance A. Then, thoroughly mix both substances.
- Apply the mixed adhesive onto the PCB or circuit board material as quickly as possible.
- Allow the adhesive to fully cure for 10 to 24 hours once the board is completely covered.
Precautions
- Check whether the circuit board material to be used with this product is usable and undamaged.
- Additional substance B can be added to accelerate the curing time, but it may affect the adhesive’s properties.
- Higher ambient temperatures will reduce the adhesive’s curing time. Avoid using near flames or direct heat to maintain adhesive curing and performance.
- If the circuit board material is less than 20 millimeters thick, air bubbles can be naturally removed. Otherwise, use a vacuum degassing machine to remove air bubbles from the adhesive.
Storage
- Store substance A and substance B separately in a dry place away from sunlight at temperatures ≤ 25℃.
- After use, tightly close the container lid to extend its shelf life for future use.
- Shelf life is 12 months after production.
