K-5204K Thermal conductive adhesive 80g

Usage

Used for electronic components such as printed circuit boards (PCBs) or electronic devices that need to be adhered to heat sinks.

Specific Properties

• Not rigid | Exterior: White
• Viscosity (mpa.s): Flexible
• Density (g/cm^3): 2.5~3.0
• Initial setting time (25℃, min): ≤ 10

Physical Properties

• Elongation at break (%): ≥ 100
• Hardness (Shore A): 50~65
• Shear strength (mpa): ≥ 1.5
• Temperature resistance (℃): -60~280

Electrical Properties

• Dielectric strength (kV/mm): ≥ 18
• Electrical field resistance (at 60 Hz): 2.8
• Volume resistivity (Ω.cm): ≥ 1.0×10^15
• Thermal conductivity (w/m.k): 1.6

Instructions

1. Clean the surface and remove any oil residues.
2. Apply the adhesive to the electronic device that needs to be attached to the heat sink.
3. The adhesive thickness should be 2~4 millimeters.
4. The adhesive will set within 24 hours at room temperature with 55% humidity.

Precautions

• Thicker adhesive or lower temperature may prolong curing time.
• Store in a dry place away from sunlight at temperatures ≤ 25℃.
• After use, tightly close the lid to extend the shelf life.
• Remove any adhesive residues around the lid before using it again.

Storage

• Store in a dry place away from sunlight at temperatures ≤ 25℃.
• Shelf life: 12 months after production.