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PCB Circuit Board Lamination

PCB Circuit Board Lamination

Purpose of board lamination

 
Printed circuit boards and components are primarily coated with a protective film to avoid or at least minimize electrical degradation when subjected to environmental stress under special operating conditions. No coating will withstand environmental stress and most stresses have cumulative effects and will eventually destroy the protection that the coating provides. If the performance decreases to an acceptable level within the acceptable time, the coating can be considered to have the protective effect it should have.
 
It is generally believed that the most dangerous and often the most common environmental stressor is humidity. Excessive moisture reduces the insulation resistance between conductors, accelerates high-voltage breakdown, reduces Q-value and corrodes conductors

PCB Circuit Board Lamination

Contamination on a printed circuit board can contain hundreds of the same type of contamination and the potential hazards are equivalent. These contaminations, such as moisture, can cause electrical deterioration, corrosion of conductors and even cause short circuits. In electronics, the most common contaminants are the various chemicals that remain in the manufacturing process, including: solvent fluxes, mold release agents, metal particles, and imprints. There are significant levels of contamination that operators are left unattended, such as fingerprint oils, cosmetics, and food oils. The surrounding working environment can also cause many kinds of pollution, such as salt spray, bauxite, dust, fuel, acid, other corrosive steam and mold.
 
Although substances that can cause contamination are virtually indispensable. But it is gratifying that, in addition to the most severe cases, the use of high-quality coatings can eliminate the damage caused by contamination.
The coating is less than 0.005 inches thick. But it is resistant to mechanical shock and vibration. but also resistant to temperature changes and the effects of high temperature applications. However, the thin coating cannot be considered sufficient mechanical strength or insulation for discrete components mounted on the printing plate. Components must be mechanically fixed and a suitable seal layer must be provided by themselves.
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PCB Circuit Board Lamination

Purpose of board lamination
Printed circuit boards and components are primarily coated with a protective film to avoid or at least minimize electrical degradation when subjected to environmental stress under special operating conditions. No coating will withstand environmental stress and most stresses have cumulative effects and will eventually destroy the protection that the coating provides. If the performance decreases to an acceptable level within the acceptable time, the coating can be considered to have the protective effect it should have.
It is generally believed that the most dangerous and often the most common environmental stressor is humidity. Excessive moisture reduces the insulation resistance between conductors, accelerates high-voltage breakdown, reduces Q-value and corrodes conductors

Contamination on a printed circuit board can contain hundreds of the same type of contamination and the potential hazards are equivalent. These contaminations, such as moisture, can cause electrical deterioration, corrosion of conductors and even cause short circuits. In electronics, the most common contaminants are the various chemicals that remain in the manufacturing process, including: solvent fluxes, mold release agents, metal particles, and imprints. There are significant levels of contamination that operators are left unattended, such as fingerprint oils, cosmetics, and food oils. The surrounding working environment can also cause many kinds of pollution, such as salt spray, bauxite, dust, fuel, acid, other corrosive steam and mold.
Although substances that can cause contamination are virtually indispensable. But it is gratifying that, in addition to the most severe cases, the use of high-quality coatings can eliminate the damage caused by contamination.
The coating is less than 0.005 inches thick. But it is resistant to mechanical shock and vibration. but also resistant to temperature changes and the effects of high temperature applications. However, the thin coating cannot be considered sufficient mechanical strength or insulation for discrete components mounted on the printing plate. Components must be mechanically fixed and a suitable seal layer must be provided by themselves.
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